1. 2. 3. material content data sheet sales product name tle9879qxa20 issued 28. june 2015 ma# ma001370614 package pg-vqfn-48-31 weight* 129.96 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.821 3.71 3.71 37093 37093 leadframe inorganic material phosphorus 7723-14-0 0.018 0.01 138 non noble metal zinc 7440-66-6 0.072 0.06 551 non noble metal iron 7439-89-6 1.433 1.10 11028 non noble metal copper 7440-50-8 58.193 44.77 45.94 447766 459483 wire non noble metal copper 7440-50-8 0.619 0.48 0.48 4765 4765 encapsulation organic material carbon black 1333-86-4 0.181 0.14 1394 plastics epoxy resin - 7.668 5.90 59004 inorganic material silicondioxide 60676-86-0 52.531 40.42 46.46 404198 464596 leadfinish non noble metal tin 7440-31-5 2.596 2.00 2.00 19978 19978 plating noble metal silver 7440-22-4 0.614 0.47 0.47 4723 4723 glue plastics epoxy resin - 0.280 0.22 2153 noble metal silver 7440-22-4 0.937 0.72 0.94 7209 9362 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and does not use any exemption. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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